YES Introduces TersOnus TGV Tool for Semiconductor Packaging

YES, a leading manufacturer of process equipment for semiconductor advanced packaging, has introduced the TersOnus TGV tool, a state-of-the-art system designed for panel-level manufacturing. This cutting-edge tool is specifically crafted to support the development of advanced heterogeneous packaging for artificial intelligence chips that power large language models.

The TersOnus TGV system by YES is equipped with advanced technologies to create high aspect ratio through glass vias on various glass types. It offers flexibility in via configurations, including hourglass, straight, and tapered vias, using diverse chemistries. These sub-50 µm vias can be customized to meet specific customer requirements in terms of aspect ratios.

Currently, leading semiconductor manufacturers worldwide are utilizing the TersOnus TGV system for producing advanced 2.5D and 3D packages. The semiconductor industry is shifting towards chiplet-based architectures to meet the demands of emerging applications, necessitating larger substrate sizes that traditional organic materials cannot economically provide. Glass-based substrates are becoming increasingly crucial for these cutting-edge applications.

YES's Wet process tools for creating TGVs on glass panels are fully automated and can handle multiple panels simultaneously. These tools offer integrated in-line metrology for precise process control and consistent etch performance. By delivering superior products with low cost-of-ownership and high reliability, YES maintains its leadership in the advanced packaging market.

The TersOnus TGV system showcases YES's dedication to meeting customer needs by providing excellent etch rates and aspect ratios for challenging through glass vias while reducing manufacturing cycle times. This system is part of YES's commitment to innovation in the glass panel market for AI applications.

YES, or Yield Engineering Systems, Inc., specializes in manufacturing high-tech, cost-effective equipment for surface transformation, material modification, and interface enhancement. Their product range includes vacuum cure ovens, chemical vapor deposition systems, and plasma etching tools used in various industries such as Advanced Packaging, MEMS, Augmented Reality/Virtual Reality, and Life Sciences. With headquarters in Fremont, California, YES serves customers globally, enabling them to create and mass-produce products across diverse markets.

With the introduction of the TersOnus TGV system, YES continues to drive innovation in semiconductor manufacturing, particularly in the realm of advanced packaging for AI applications. By offering cutting-edge solutions that enhance efficiency and quality, YES remains at the forefront of technological advancements, catering to the evolving needs of the industry.